Technical principle:

The stealth cutting technology is to gather a laser beam of a translucent wavelength inside the wafer to form a starting point for segmentation (the modified layer: hereinafter referred to as an SD layer), and then apply an external force to the wafer to divide it into small chips. Cutting technology.
Equipment Name: Fully automatic stealth dicing machine
Model:  WS9096

Model features

Advantages and scope of application

Features:
Cutting DBR coated chip with 1064nm wavelength ultrafast laser

The world's second fast, high-precision real-time focus correction system (DRA) with proprietary intellectual property rights to process larger wafer sizes

Multi-laser spot cutting technology, providing high-efficiency ultra-high power wafers (T=300um) for high-speed cutting, X-axis cutting speeds up to 1000mm/s

Compatible with 2", 4", 6" wafers

Bar code reading function, real-time monitoring and tracking in the chip production process

It has the function of automatically judging the oblique crack, which improves the AOI yield of the chip.

Fully automatic loading and unloading function, unattended automatic operation (cartridge mode, whole box loading and unloading), mass production of products

Sample Pictures